Chip-Designer Skyechip Inks Underwriting Deal for Malaysia IPO
Malaysian chip-design firm Skyechip Bhd. has signed an underwriting agreement with local banks for an initial public offering, with proceeds earmarked for the research and development of artificial intelligence products.
By Ram Anand · Bloomberg Markets
Malaysian chip-design firm Skyechip Bhd. has signed an underwriting agreement with local banks for an initial public offering, with proceeds earmarked for the research and development of artificial intelligence products.