A $2 Billion Deal Brings a Missing Piece of the AI Chip to New York
GlobalFoundries will make silicon interposers for TSMC's advanced AI packaging in Malta, New York, the first U.S.-based source. In our view, it is a practical step toward bringing the whole AI supply chain home.
By Clara Hughes
ALTAS WORLD NEWS OPINION | By Clara Hughes, Chief Opinion Editor | October 9, 2026 | 6-min read The most powerful AI chips in the world have a dirty little secret. Even when the silicon is made in Arizona, the finished product has needed a round trip to Taiwan for final assembly, The Register reports [3]. On Thursday, one piece of that puzzle moved closer to home. GlobalFoundries announced a $2 billion, five-year agreement to make a key piece of those chips for TSMC, the world's leading chipmaker, at its factory in Malta, New York [1][2]. In our view, this is exactly the kind of quiet, practical win that rebuilds American manufacturing one link at a time. Key Takeaways GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging at its Malta, New York, plant under a $2 billion agreement with an initial five-year term [1][2]. The company says Malta will become the first U.S.-based source of silicon interposers for these advanced packaging technologies [1]. Volume production is expected to begin ramping in the first half of 2028, so the payoff is still more than a year away [1]. Here is why this matters. America has spent years trying to bring chipmaking home, and real progress has been made on the factories